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 RE46C162/163
CMOS Ionization Smoke Detector ASIC with Interconnect, Timer Mode and Alarm Memory
Features
* Pin Selectable Horn Patterns * Alarm Memory * Sensitivity Control Timer: - 8 minute Timer for RE46C162 - 1 minute Timer for RE46C163 * >1500V ESD Protection (HBM) on All Pins * Guard Outputs for Ion Detector Input * 0.75 pA Detect Input Current * Internal Reverse Battery Protection * Low Quiescent Current Consumption (<6.5 A) * I/O Filter and Charge Dump * Internal Low Battery Detection * Power-up Low Battery Test * Interconnect up to 66 Detectors * RoHS Compliant, Lead Free Packaging
Description
The RE46C162/163 devices are low-power, CMOS ionization type, smoke detector ICs. With few external components, these circuits will provide all the required features for an ionization type smoke detector. An internal oscillator strobes power to the smoke detection circuitry for 10.5 ms every 1.67 seconds to keep standby current to a minimum. A check for a low battery condition is performed every 40 seconds when in standby. The temporal horn pattern supports the NFPA 72 emergency evacuation signal. An interconnect pin allows multiple detectors to be connected so when one unit alarms, all units will sound. A charge dump feature will quickly discharge the interconnect line when exiting a local alarm. The interconnect input is also digitally filtered. An internal timer allows for a single button, push-to-test to be used for a reduced sensitivity mode. An alarm memory feature allows the user to determine if the unit has previously entered a local alarm condition. Utilizing low-power CMOS technology, the RE46C162/163 devices are designed for use in smoke detectors that comply with Underwriters Laboratory Specification UL217 and UL268.
Package Types
RE46C162/163 PDIP TSTART IO TONE TSTROBE LED VDD RBIAS FEED 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 GUARD2 DETECT GUARD1 VSEN OSCAP HS HB VSS
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DS22245A-page 1
RE46C162/163
Functional Block Diagram
TONE (3) VDD(6) Reference R2 760K R3 340K + + Low Battery Comparator IO (2) FEED (8) HS (11) Logic and Timing
TSTART (1) VSEN (13)
HB (10) LED (5)
R4 1100K
Smoke Comparator Bias and Power Reset
TSTROBE (4)
GUARD1 (14) DETECT (15) GUARD2 (16) VSS(9) + -
RBIAS (7) Oscillator OSCAP (12)
Guard Amp
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RE46C162/163
Typical Applications
RE46C162 Typical Application - Temporal Horn Pattern
TEST and HUSH R6 68K
R5 100K To Other R7 Units 100 Dled R8 1.5K 1 TSTART 2 IO 3 TONE R2 390 4 TSTROBE 5 LED 9V Battery + 1 F C2
R1 GUARD2 16 DETECT 15 GUARD1 14 VSEN 13 OSCAP 12 HS 11 HB 10 VSS
R9
6 VDD 7 RBIAS 8 FEED
8.2M
C3 .1 F
9 R3 1.5M R4 220K C1 .001 F
Note 1:
Select R5 and R6 for the correct level to test the ion chamber. The voltage level on pin 1 (TSTART) must be greater than the VIH level to initiate the timer. Pin 1 has an internal 180K nominal pull down which must be considered. Select R9 to reduce sensitivity during the timer mode. R3, R4 and C1 are typical values and may be adjusted to maximize sound pressure. C2 should be located as close as possible to the device power pins. Route the pin 8 PC board trace away from pin 7 to avoid coupling. R8 should be at least 1.5K.
2: 3: 4: 5: 6:
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RE46C162/163
RE46C162 Typical Application - 2/3 Duty Cycle Continuous Tone Horn Pattern
TEST and HUSH R6 68K
R5 100K To Other R7 Units 100 Dled 1 TSTART 2 IO 3 TONE R2 390 4 TSTROBE 5 LED 9V Battery + 1 F C2 R1 8.2M 6 VDD 7 RBIAS 8 FEED
GUARD2 16 DETECT 15 GUARD1 14 VSEN 13 OSCAP 12 HS 11 HB 10 VSS
R9
C3 .1 F
9 R3 1.5M R4 220K
C1
.001 F
Note 1:
Select R5 and R6 for the correct level to test the ion chamber. The voltage level on pin 1 (TSTART) must be greater than the VIH level to initiate the timer. Pin 1 has an internal 180K nominal pull down which must be considered. Select R9 to reduce sensitivity during the timer mode. R3, R4 and C1 are typical values and may be adjusted to maximize sound pressure. C2 should be located as close as possible to the device power pins. Route the pin 8 PC board trace away from pin 7 to avoid coupling.
2: 3: 4: 5:
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1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD....................................................................................15V Input Voltage Range Except FEED, I/O ........... VIN=-.3V to VDD +.3V FEED Input Voltage Range .................... VINFD = -10 to +22V I/O Input Voltage Range................................VIO1 = -.3 to 15V Reverse Battery Time ...............................................TRB = 5S Input Current except FEED ................................... IIN = 10 mA Operating Temperature ............................... TA = -10 to +60C Storage Temperature ............................TSTG = -55 to +125C Maximum Junction Temperature ......................... TJ = +150C
DC ELECTRICAL CHARACTERISTICS
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25C, VDD = 9V, OSCAP = .1 F, RBIAS = 8.2 M, VSS = 0V Parameter Supply Voltage Supply Current Symbol VDD IDD1 IDD2 Input Voltage High VIH1 VIH2 VIH3 Input Voltage Low VIL1 VIL2 VIL3 Input Leakage Low ILDET1 ILDET2 ILFD ILTONE Input Leakage High IHDET1 IHDET2 IHFD IIOL2 IHTONE Output Off Leakage High Input Pull Down Current IIOHZ IPD1 Test Pin 6 6 6 3,8 2 1 3,8 2 1 15 15 8 3 15 15 8 2 3 4,5 1 Min 6 -- -- 6.2 3 4.5 -- -- -- -- -- -- -- -- -- -- -- -- -- 20 Typ -- 5 -- 4.5 -- -- 4.5 -- -- -- -- -- -- -- -- -- -- -- -- 50 Max 12 6.5 9 -- -- -- 2.7 1 2.5 -0.75 -1.50 -50 -100 0.75 1.50 50 150 100 1 80 Units V A A V V V V V V pA pA A nA pA pA A A nA A A VDD = 9V, DETECT = VSS, 0-40% RH VDD = 9V, DETECT = VSS, 85% RH Note 1 FEED = -10V TONE = VSS VDD = 9V, DETECT = VDD, 0-40% RH VDD = 9V, DETECT = VDD, 85% RH Note 1 FEED = 22V No alarm, VIO = 15V TONE = VDD Outputs off TSTART = 9V IOH = -16 mA, VDD = 7.2V Note 2 No local alarm, I/O as an input Operating RBIAS = 8.2 MW, OSCAP = .1 F RBIAS = 8.2 MW, OSCAP = .1 F; VDD = 12V Note 2 No local alarm, I/O as an input Conditions
Output High Voltage VOH1 10,11 6.3 -- -- V Note 1: Sample test only. 2: Not 100% production tested. 3: Production test at room with temperature guard banded limits.
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DC ELECTRICAL CHARACTERISTICS (CONTINUED)
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25C, VDD = 9V, OSCAP = .1 F, RBIAS = 8.2 M, VSS = 0V Parameter Output Low Voltage Symbol VOL1 VOL2 VOL3 Output Current IIOL1 IIOH1 IIODMP Low Battery Voltage Internal Sensitivity Set Voltage Offset Voltage VLB VSET1 VGOS1 VGOS2 VGOS3 Common Mode Voltage VCM1 VCM2 Output Impedance Hysteresis
Note 1:
Test Pin 10,11 4 5 2 2 2 6 13 14,15 15,16 13,15 14,15 13,15 14,16
Min -- -- -- 25 -4 5 7.2 48.5 -50 -50 -50 2 .5 --
Typ -- -- -- -- -- -- 7.5 50 -- -- -- -- -- 10
Max .9 .5 1 60 -16 -- 7.8 51.5 50 50 50 VDD.5 VDD-2 --
Units V V V A mA mA V %VDD mV mV mV V V kW
Conditions IOL = 16 mA, VDD = 7.2V IOL = 500 A IOL = 10 mA, VDD = 7.2V No alarm, VIO = VDD -2V Alarm, VIO = VDD -2V or VIO = 0V At conclusion of local alarm or test, VIO = 1V TA = -10 to +60C, Note 3
Guard amplifier Guard amplifier Smoke comparator Guard amplifier, Note 2 Smoke comparator, Note 2 Guard amplifier outputs, Note 2 No alarm to alarm condition
ZOUT VHYS
2: 3:
13 90 130 170 mV Sample test only. Not 100% production tested. Production test at room with temperature guard banded limits.
AC ELECTRICAL CHARACTERISTICS
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25C, VDD = 9V, OSCAP = .1 F, RBIAS = 8.2 M, VSS = 0V. Parameter Oscillator Period Oscillator Pulse Width LED On Time LED Off Time Symbol TPER1 TPER2 TPW TLON TLOF1 TLOF2 TLOF3 TLOF4 TLOF5 Note 1: 2: Test Pin 12 12 5 5 5 5 5 5 5 Min 1.34 37.5 9.4 9.4 32 .9 8 2.66 26 Typ 1.67 41.7 10.5 10.5 40 1 10 3.33 33.3 Max 2 45.8 12.9 12.9 48 1.1 12 4 40 Units s ms ms ms s s s s s Conditions No alarm condition Alarm condition Operating Operating Standby, no alarm Alarm condition Timer mode, no alarm Alarm memory LED pulse spacing Alarm memory LED off time between pulse train
See timing diagram for horn temporal and non-temporal patterns. TPER1,TPER2 and TPW are 100% production tested. All other timing is verified by functional testing.
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AC ELECTRICAL CHARACTERISTICS (CONTINUED)
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25C, VDD = 9V, OSCAP = .1 F, RBIAS = 8.2 M, VSS = 0V. Parameter Horn On Time Symbol THON1 THON2 THON3 Horn Off Time THOF1 THOF2 THOF3 THOF4 THOF5 I/O Charge Dump Duration I/O Delay I/O Filter Remote Alarm Delay Timer Period RE46C162 RE46C163 TIODMP TIODLY1 TIOFILT TIODLY2 TTPER TAMTPER Test Pin 10,11 10,11 10,11 10,11 10,11 10,11 10,11 10,11 2 2 2 2 4 4 5 Min 450 9.4 150 450 1.35 75 32 216 1.34 -- -- .450 6 40 19.2 Typ 500 10.5 167 500 1.5 83 40 240 1.67 3 -- -- 8 50 24 Max 550 12.9 183 550 1.65 92 48 264 2.0 -- 450 2.75 10 60 28.8 Units ms ms ms ms s ms s ms s s ms s Min s Hour Conditions Operating, alarm condition, Note 1, TONE = High Low battery, no alarm or PTT in alarm memory Operating, alarm condition, Note 1, TONE = Low Operating, alarm condition, Note 1, TONE = High Operating, alarm condition, Note 1, TONE = High Operating, alarm condition, Note 1, TONE = Low Low battery, no alarm PTT in alarm memory At conclusion of local alarm or test From start of local alarm to I/O active I/O as input, no local alarm No local alarm, I/O as input, from I/O active to horn active No alarm No alarm No alarm, alarm memory
Alarm Memory Visual Indicator Period Note 1: 2:
See timing diagram for horn temporal and non-temporal patterns. TPER1,TPER2 and TPW are 100% production tested. All other timing is verified by functional testing.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, Parameters Temperature Ranges Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 16L-PDIP JA -- 70 -- C/W TA TSTG -10 -55 -- -- +60 +125 C C Sym Min Typ Max Units Conditions
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NOTES:
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2.0 PIN DESCRIPTIONS
PIN FUNCTION TABLE
Name PDIP, SOIC 1 2 3 4 TSTART I/O TONE TSTROBE This input is used to invoke the push-to-test alarm, alarm memory indication, and the timer mode. This input has an internal pull-down. This bidirectional pin provides the capability to interconnect many detectors in a single system. This pin has an internal pull-down. This pin selects the NFPA72 horn tone (high) or the 2/3 duty cycle continuous tone (low). This pin is strobed on with the internal clock in timer mode. A resistor connected to this pin is used to modify the detector sensitivity for the timer period. Open drain NMOS output used to drive a visible LED. Connect to the positive supply voltage. A resistor connected between this pin and VDD sets the internal bias current. Usually connected to the feedback electrode through a current limiting resistor. If not used, this pin must be connected to VDD or VSS. Connect to the negative supply voltage. This pin is connected to the metal electrode of a piezoelectric transducer. HS is a complementary output to HB and connects to the ceramic electrode of the piezoelectric transducer. A capacitor connected between this pin and VSS sets the oscillator timing. This pin can be used to modify the set point for the smoke comparator by use of external resistors to VDD or VSS. Output of the guard amplifier. Connect to the collector electrode (CEV) of the ion smoke chamber. Output of the guard amplifier. Description The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
RE46C162/163
5 6 7 8 9 10 11 12 13 14 15 16
LED VDD RBIAS FEED VSS HB HS OSCAP VSEN GUARD1 DETECT GUARD2
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NOTES:
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3.0
3.1
DEVICE DESCRIPTION
Internal Timing
3.5
Interconnect
With external components as indicated on the application drawing, the period of the oscillator is nominally 1.67 seconds in standby. Every 1.67 seconds, the detection circuitry is powered up for 10.5 ms and the status of the smoke comparator is latched. In addition, every 40 seconds the LED driver is turned on for 10.5 ms and the status of the low battery comparator is latched. The smoke comparator status is not checked during the low battery test, during the low battery horn warning chirp, or when the horn is on due to an alarm condition. If an alarm condition is detected, the oscillator period increases to 41.7 ms. Due to the low current used in the oscillator, the capacitor on the OSCAP pin should be a low leakage type.
The I/O pin provides a capability common to many detectors in a single system. If a single unit goes into alarm, the I/O pin is driven high. This high signal causes the interconnected units to alarm. The LED flashes every 1s for 10.5 ms on the signaling unit and is inhibited on the units that are in alarm due to the I/O signal. An internal sink device on the I/O pin helps to discharge the interconnect line. This charge dump device is active for 1 clock cycle after the unit exits the alarm condition (1.67s). The interconnect input has a 500 ms nominal digital filter. This allows for interconnection to other types of alarms (carbon monoxide for example) that may have a pulsed interconnect signal.
3.6
Testing
3.2
Smoke Detection Circuit
The smoke comparator compares the ionization chamber voltage to a voltage derived from a resistor divider across VDD. This divider voltage is available externally on the VSEN pin. When smoke is detected, this voltage is internally increased by 130 mV nominal to provide hysteresis and make the detector less sensitive to false triggering. The VSEN pin can be used to modify the internal set point for the smoke comparator by use of external resistors to VDD or VSS. Nominal values for the internal resistor divider are indicated on the block diagram. These internal resistor values can vary by up to 20%, but the resistor matching should be <2% on any one device. The transmission switch on VSEN prevents any interaction from the external adjustment resistors. The guard amplifier and outputs are always active and will be within 50 mV of the DETECT input to reduce surface leakage. The guard outputs also allow for measurement of the DETECT input without loading the ionization chamber.
At power-up all internal registers are reset. The low battery set point can be tested at power-up by holding FEED and OSCAP low at power-up. HB will change state as VDD passes through the low battery set point. By holding the OSCAP pin low, the internal power strobe is active. Functional testing can be accelerated by driving OSCAP with a 4 kHz square wave; however, the 10.5 ms strobe period must be maintained for proper operation of the analog circuitry. Refer to Figure 3-1 timing diagram.
3.7
Timer Mode
The transition of the TSTART pin from a high to low level initiates a timer period (10 minutes maximum for RE46C162, and 1 minute maximum for RE46C163). During this timer period, the open drain NMOS on the TSTROBE pin is strobed simultaneously with the internal clock. A resistor connected to this pin and the VSEN pin is used to modify the detector sensitivity for the timer period. During the timer period, the LED flashes for 10.5 ms every 10 seconds. If the smoke level exceeds the reduced sensitivity set point during the timer period, the unit will go into a local alarm condition, the horn will sound and the timer mode is cancelled. If an external only alarm occurs during the timer mode, the timer mode is cancelled. If the test button is pushed in a standby, reduced sensitivity mode, the unit is tested normally. Upon release of the test button, the timer mode counter is reset and restarted.
3.3
Low Battery Detection
An internal reference is compared to the voltagedivided VDD supply. The battery can be checked under load via the LED low side driver output since low battery status is latched at the end of the 10.5 ms LED pulse.
3.4
LED Pulse
The LED is pulsed on for 10.5 ms every 40s in standby. In alarm, the LED is pulsed on for 10.5 ms every 1 second.
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RE46C162/163
3.8 Alarm Memory
If a detector has entered a local alarm, once it exits the local alarm, the alarm memory latch is set. Initially the LED can be used to visually identify any unit that had previously been in a local alarm condition. The LED will flash 3 times spaced 3.3 seconds apart. This pattern will repeat every 40 seconds. The duration of the flash is 10.5 ms. In order to conserve battery power, this visual indication will stop after a period of 24 hours. The user will still be able to identify a unit with an active alarm memory by pressing the push-to-test button. When the push-to-test button is active, the horn will chirp for 10.5 ms every 250 ms. If the alarm memory condition is set, any time the pushto-test button is pressed and then released, the alarm memory latch is reset.
Standby Mode; No Low Bat tery; No Alarm Alarm; No Low Battery
The initial 24 hour visual indication is not displayed if a low battery condition exits.
3.9
Tone Select
The TONE pin selects the NFPA72 temporal horn tone (high), or the 2/3 duty cycle continuous tone (low). If this pin is externally connected high, use a current limiting resistor of at least 1.5K from TONE pin to VDD.
3.10
Reverse Battery Protection
The RE46C162/163 internally limits the current from VSS to VDD in the event of accidental polarity reversal. If an input is connected to VDD it should be done through a resistance of at least 1.5K to limit the reverse current through this path.
Alarm; Low Battery
No Alarm; Low Battery
Oscillator
P in 15 > Pin 13 Pin 13 > Pin 15; 130mV Level Shift on P in 13 Pin 15 > Pin 13
T PER1 Inte rnal Clock
TPW
TPER2
24 Cloc k Cyc les (40 S)
24 Cloc k Cy cles (1S)
LED
Sample Smoke
Low Battery Warning Chirp
Horn
See F igure Below for C omplete Horn Cycle
TIODLY1 IO (Pin 2) as Output IO Charge Dump TIOFILT IO ( Pin 2) a s Input TIODLY2 Horn
Start of horn tem poral pattern is not sy nc hroniz ed to an ex ternal alarm Horn pattern not self completing for external alarm,s ee timing below for complete horn c ycle Timing not same scale as above
TIODMP
LED supress ed in remote alarm mode
Inte rnal Clock Note s: 1. Smoke is not sampled when the ho rn is active. Horn cycle is self completing in local alarm. 2. L ow battery warnin g chirp is suppressed in local or re mote alarm 3. IO Dump active on ly in loca l alarm, inactive if external alarm THON1 THOF1 T HOF2
Complete Temporal Horn Pattern THON3
THOF3 Non -Temporal Horn Pattern
FIGURE 3-1:
Timing Diagram - Standby, Local Alarm, Low Battery.
DS22245A-page 12
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RE46C162/163
Oscillator TPW TPER1
Internal Clock
TSTART TLOF3 LED Outputs High Z TSTROBE TTPER
FIGURE 3-2:
Timing Diagram -Timer Mode.
AlarmMemory Alarm, No Low Battery Alarm Memory; No Alarm; No Low Battery AlarmMemory After 24 Hour Timer Indication Standby
LED
TLOF2
TLON
TLOF4 TLOF5
TLOF1
TLOF1
THON2 TAMTPER HB
THOF5
TSTART
FIGURE 3-3:
Timing Diagram - Alarm Memory Mode.
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NOTES:
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4.0
4.1
PACKAGING INFORMATION
Package Marking Information
16-Lead PDIP Example
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
RE46C162-V/P 1003256
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
2010 Microchip Technology Inc.
DS22245A-page 15
RE46C162/163
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RE46C162/163
APPENDIX A: REVISION HISTORY
Revision A (March 2010)
* Original Release of this Document.
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NOTES:
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RE46C162/163
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. /X XX Examples:
a) b) RE46C162E16F: RE46C163E16F: 16LD PDIP Package. 16LD PDIP Package.
Device Package Number of Pins
Device
RE46C162: RE46C163: E =
CMOS Ionization Smoke Detector CMOS Ionization Smoke Detector Plastic Dual In-Line, 300 mil. Body, 16-Lead (PDIP)
Package
2010 Microchip Technology Inc.
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NOTES:
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2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-126-0
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2010 Microchip Technology Inc.
DS22245A-page 21
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AMERICAS
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01/05/10
DS22245A-page 22
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